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Novel low-temperature polycrystalline-silicon power devices with very-low on-resistance using excimer laser-crystallization

dc.citation.epageG903en_US
dc.citation.issue12en_US
dc.citation.spageG900en_US
dc.citation.volume151en_US
dc.citation.woscount1
dc.contributor.authorCheng, HCen_US
dc.contributor.authorChang, FLen_US
dc.contributor.authorLin, MJen_US
dc.contributor.authorTsai, CCen_US
dc.contributor.authorLiaw, CWen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:39:57Z
dc.date.available2014-12-08T15:39:57Z
dc.date.issued2004en_US
dc.description.abstractLow-temperature poly-Si lateral double-diffused metal oxide semiconductor (LTPS LDMOS) with high voltage and very low on-resistance has been achieved using excimer laser crystallization at 400 degreesC substrate heating for the first time. The ON/OFF current ratios were 2.96 x 10(5) and 6.72 x 10(6) while operating at V-ds = 0.1 and 10 V, respectively. The maximum current limit was up to 10 mA and maximum power limit could be enhanced over 1 W at V-ds = 90 V and V-gs = 20 V. The R-on,R-sp with dimensions of W/L-ch = 600 mum/12 mum could be significantly decreased 6.67 x 10(2) times in magnitude as compared with conventional offset drain thin-film-transistors. (C) 2004 The Electrochemical Society.en_US
dc.identifier.doi10.1149/1.1819771en_US
dc.identifier.issn0013-4651en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1819771en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/27308
dc.identifier.wosnumberWOS:000225068500080
dc.language.isoen_USen_US
dc.titleNovel low-temperature polycrystalline-silicon power devices with very-low on-resistance using excimer laser-crystallizationen_US
dc.typeArticleen_US

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