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深次微米CMOS元件之複晶矽介電層與閘極氧化層之技術開發

dc.contributor.author雷添福en_US
dc.contributor.authorLEI TAN-FUen_US
dc.contributor.department交通大學電子工程系zh_TW
dc.date.accessioned2014-12-13T10:37:13Z
dc.date.available2014-12-13T10:37:13Z
dc.date.issued1999en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC88-2215-E009-045zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=444190&docId=80439en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/94461
dc.language.isozh_TWen_US
dc.subject深次微米zh_TW
dc.subject複晶矽zh_TW
dc.subject介電層zh_TW
dc.subject閘極氧化層zh_TW
dc.subject互補式金氧半導體zh_TW
dc.subjectDeep submicronen_US
dc.subjectPolysiliconen_US
dc.subjectDielectric layeren_US
dc.subjectGate oxideen_US
dc.subjectCMOSen_US
dc.title深次微米CMOS元件之複晶矽介電層與閘極氧化層之技術開發zh_TW
dc.titleTechnology Development on Polysilicon Dielectric Layers and Gate Oxides for Deep Submicron CMOS Devicesen_US
dc.typePlanen_US

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