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Improved Electrical Performance and Uniformity of MILC Poly-Si TFTs Manufactured Using Drive-In Nickel-Induced Lateral Crystallization

dc.citation.epage1178en_US
dc.citation.issue11en_US
dc.citation.spage1176en_US
dc.citation.volume30en_US
dc.citation.woscount7
dc.contributor.authorChang, Chih-Pangen_US
dc.contributor.authorWu, YewChung Sermonen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:08:23Z
dc.date.available2014-12-08T15:08:23Z
dc.date.issued2009-11-01en_US
dc.description.abstractA new manufacturing method for polycrystalline silicon (poly-Si) thin-film transistors (TFTs) using drive-in nickel-induced lateral crystallization (DILC) was proposed. In DILC, a F(+) implantation was used to drive Ni in the alpha-Si layer. To reduce Ni contamination, the remained Ni film was then removed and subsequently annealed at 590 degrees C. It was found that DILC TFTs exhibit high field-effect mobility, low threshold voltage, low subthreshold slope, high ON-state current, lower trap-state density, smaller standard deviations, and low OFF-state leakage current compared with conventional Ni-metal-induced lateral crystallization TFTs.en_US
dc.identifier.doi10.1109/LED.2009.2031130en_US
dc.identifier.issn0741-3106en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2009.2031130en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/6493
dc.identifier.wosnumberWOS:000271151500020
dc.language.isoen_USen_US
dc.subjectDrive-in nickel-induced lateral crystallization (DILC)en_US
dc.subjectfluorine ion (F(+)) implantationen_US
dc.subjectthin-film transistors (TFTs)en_US
dc.subjectuniformityen_US
dc.titleImproved Electrical Performance and Uniformity of MILC Poly-Si TFTs Manufactured Using Drive-In Nickel-Induced Lateral Crystallizationen_US
dc.typeArticleen_US

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