METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE
| dc.citation.epage | 542 | en_US |
| dc.citation.issue | 3 | en_US |
| dc.citation.spage | 537 | en_US |
| dc.citation.volume | 18 | en_US |
| dc.citation.woscount | 19 | |
| dc.contributor.author | CHIOU, BS | en_US |
| dc.contributor.author | CHANG, JH | en_US |
| dc.contributor.author | DUH, JG | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:03:14Z | |
| dc.date.available | 2014-12-08T15:03:14Z | |
| dc.date.issued | 1995-08-01 | en_US |
| dc.description.abstract | Intermetallic formation between electroless-plated copper and Sn/Pb solder is investigated. An interlayer is formed between copper and solder, and segregation of Pb-rich and Sn-rich phases are observed. X-ray diffraction and EDX analysis results suggest that the major intermetallic formed in the interlayer is Cu6Sn5. For the as-plated sample, the adhesion strength of Cu to the AIN substrate after 150 degrees C aging is affected by both the recrystallization and the creep of copper. For the soldered specimen, the presence of intermetallic compound causes cracks to propagate along the intermetallic/Cu interface and results in a decrease of the adhesion strength. | en_US |
| dc.identifier.issn | 1070-9894 | en_US |
| dc.identifier.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/1802 | |
| dc.identifier.wosnumber | WOS:A1995RN87900019 | |
| dc.language.iso | en_US | en_US |
| dc.title | METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE | en_US |
| dc.type | Article | en_US |