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INTERACTION OF COBALT AND FIELD OXIDE DURING LOW-TEMPERATURE FURNACE ANNEALING

dc.citation.epage757en_US
dc.citation.issue8en_US
dc.citation.spage756en_US
dc.citation.volume28en_US
dc.citation.woscount2
dc.contributor.authorCHEN, BSen_US
dc.contributor.authorCHEN, MCen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:04:56Z
dc.date.available2014-12-08T15:04:56Z
dc.date.issued1992-04-09en_US
dc.description.abstractThe interaction of cobalt and thermally grown field oxide (5000 angstrom) during low temperature furnace annealing (600-800-degrees-C) is described. It is found that the isolation function of oxide becomes unreliable and s-pit clusters from in the silicon substrate when the annealing temperature exceeds 700-degrees-C. Therefore, it is essential to limit the first annealing temperature of the selfaligned silicide scheme below 600-degrees-C.en_US
dc.identifier.issn0013-5194en_US
dc.identifier.journalELECTRONICS LETTERSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/3454
dc.identifier.wosnumberWOS:A1992HP54300036
dc.language.isoen_USen_US
dc.subjectANNEALINGen_US
dc.subjectSEMICONDUCTOR DEVICES AND MATERIALSen_US
dc.titleINTERACTION OF COBALT AND FIELD OXIDE DURING LOW-TEMPERATURE FURNACE ANNEALINGen_US
dc.typeArticleen_US

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