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Analysis of physical properties of III-nitride thin films by nanoindentation

dc.citation.epage500en_US
dc.citation.issue6en_US
dc.citation.spage496en_US
dc.citation.volume32en_US
dc.citation.woscount33
dc.contributor.authorJian, SRen_US
dc.contributor.authorFang, THen_US
dc.contributor.authorChuu, DSen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.date.accessioned2014-12-08T15:40:48Z
dc.date.available2014-12-08T15:40:48Z
dc.date.issued2003-06-01en_US
dc.description.abstractThe thin films of undoped GaN, GaN:Si, and Al0.12Ga0.88N on sapphire (0001) substrate using nanoindentation are investigated. The Young's modulus, hardness, and plastic energy of the films were calculated from the loading-unloading curve. The true hardness, maximum shear stress, and degree of elastic recovery are then deduced from the preceding calculated data. In addition, the loading-unloading curve clearly shows the pop-in phenomena, which can be attributed to the dislocation nucleation. To better understand the factors affecting the quality of films produced, the stress-strain relationship, which is able to reflect the quality of the fabricated films, is also analyzed using nanoindentation.en_US
dc.identifier.issn0361-5235en_US
dc.identifier.journalJOURNAL OF ELECTRONIC MATERIALSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/27821
dc.identifier.wosnumberWOS:000183490500005
dc.language.isoen_USen_US
dc.subjectnanoindentationen_US
dc.subjectYoung's modulusen_US
dc.subjecthardnessen_US
dc.subjectmaximum shear stressen_US
dc.subjectplastic energyen_US
dc.subjectelastic recoveryen_US
dc.subjectcontact stress-strainen_US
dc.titleAnalysis of physical properties of III-nitride thin films by nanoindentationen_US
dc.typeArticleen_US

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