Effects of interfacial sulfidization and thermal annealing on the electrical properties of an atomic-layer-deposited Al(2)O(3) gate dielectric on GaAs substrate

Abstract

In this study we investigated the interfacial chemistry occurring between an atomic-layer-deposited Al(2)O(3) high-k film and a GaAs substrate and the impact of sulfidization and thermal annealing on the properties of the resultant capacitor. We observed that sulfide passivation of the Al(2)O(3)/GaAs structure improved the effect of Fermi level pinning on the electrical characteristics, thereby providing a higher oxide capacitance, smaller frequency dispersion, and reduced surface states, as well as decreased interfacial charge trapping and gate leakage currents. Photoemission analysis indicated that the (NH(4))(2)S-treated GaAs improved the quality of the as-deposited Al(2)O(3) thin film and preserved the stoichiometry of the dielectric during subsequent high-temperature annealing. This behavior was closely correlated to the diminution of GaAs native oxides and elemental arsenic defects and their unwanted diffusion. In addition, thermal processing under an O(2) atmosphere, relative to that under N(2), decreased the thickness of the Al(2)O(3) gate dielectric and relieved the gate leakage degradation induced by metallic arsenic; as a result, superior dielectric reliability was attained. We discuss the underlying thermochemical reactions that account for these experimental observations. (C) 2008 American Institute of Physics.