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NANOMETER THICK SI/SIGE STRAINED-LAYER SUPERLATTICES GROWN BY AN ULTRAHIGH-VACUUM CHEMICAL-VAPOR-DEPOSITION TECHNIQUE

dc.citation.epage3445en_US
dc.citation.issue7en_US
dc.citation.spage3441en_US
dc.citation.volume75en_US
dc.citation.woscount6
dc.contributor.authorCHANG, TCen_US
dc.contributor.authorCHANG, CYen_US
dc.contributor.authorJUNG, TGen_US
dc.contributor.authorTSAI, WCen_US
dc.contributor.authorWANG, PJen_US
dc.contributor.authorLEE, TLen_US
dc.contributor.authorCHEN, LJen_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.department奈米中心zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.contributor.departmentNano Facility Centeren_US
dc.date.accessioned2014-12-08T15:04:02Z
dc.date.available2014-12-08T15:04:02Z
dc.date.issued1994-04-01en_US
dc.description.abstractHigh quality Si/Si1-xGex superlattices having layers as thin as 1.5 nm have been grown by an ultrahigh vacuum/chemical vapor deposition system. High-resolution double-crystal x-ray diffraction, and conventional and high-resolution cross-sectional transmission electron microscopy were used to evaluate the crystalline quality of these superlattices. A dynamical x-ray simulation program was employed to analyze the experimental rocking curves. Excellent matches between experimental rocking curves and simulated ones were obtained for all superlattices with various periodicity. A cross-sectional transmission electron micrograph of an 80 period Si(4.2 nm)/Si0.878Ge0.122 (1.5 nm) superlattice, in which each individual layers was clearly resolved, demonstrated the capability of this growth technique for nanometer thick layer deposition.en_US
dc.identifier.doi10.1063/1.356104en_US
dc.identifier.issn0021-8979en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.356104en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/2540
dc.identifier.wosnumberWOS:A1994NC83900027
dc.language.isoen_USen_US
dc.titleNANOMETER THICK SI/SIGE STRAINED-LAYER SUPERLATTICES GROWN BY AN ULTRAHIGH-VACUUM CHEMICAL-VAPOR-DEPOSITION TECHNIQUEen_US
dc.typeArticleen_US

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