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Methane Exposure on the Aluminum Nitride Gate Dielectric in Pentacene-Based Organic Thin-Film Transistors

dc.citation.epageH356en_US
dc.citation.issue10en_US
dc.citation.spageH353en_US
dc.citation.volume12en_US
dc.citation.woscount1
dc.contributor.authorChou, Cheng-Weien_US
dc.contributor.authorZan, Hsiao-Wenen_US
dc.contributor.authorWang, Chung-Hwaen_US
dc.contributor.authorChen, Wei-Tsungen_US
dc.contributor.authorTsai, Li-Shiuanen_US
dc.contributor.authorWang, Wen-Chiehen_US
dc.contributor.authorHwang, Jenn-Changen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.date.accessioned2014-12-08T15:10:28Z
dc.date.available2014-12-08T15:10:28Z
dc.date.issued2009en_US
dc.description.abstractThe device performance of a pentacene-based organic thin-film transistor (OTFT) fabricated on an aluminum nitride (AlN) surface can be improved by exposing AlN to a methane (CH(4)) gas before device fabrication. The mobility of the OTFT was enhanced from 0.046 to 0.924 cm(2)/V s by exposing AlN to CH(4). Its threshold voltage was reduced from -4.5 to -1.9 V. After the CH(4) exposure, the reduced surface energy of AlN was correlated with the improvement of the OTFT performance. The reduction of surface energy was correlated with the replacement of O-C=O bonds by C-O bonds and hydrocarbon (CH(x)) on the AlN surface. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3182823] All rights reserved.en_US
dc.identifier.doi10.1149/1.3182823en_US
dc.identifier.issn1099-0062en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.3182823en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/8002
dc.identifier.wosnumberWOS:000268962800012
dc.language.isoen_USen_US
dc.titleMethane Exposure on the Aluminum Nitride Gate Dielectric in Pentacene-Based Organic Thin-Film Transistorsen_US
dc.typeArticleen_US

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