高密度多層構裝基板與接合材料研究---總計畫(III)
| dc.contributor.author | 邱碧秀 | en_US |
| dc.contributor.author | CHIOU BI-SHIOU | en_US |
| dc.contributor.department | 國立交通大學電子工程學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:39:33Z | |
| dc.date.available | 2014-12-13T10:39:33Z | |
| dc.date.issued | 2001 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC90-2216-E009-031 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=673257&docId=128264 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/96608 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 高密度 | zh_TW |
| dc.subject | 多層基板 | zh_TW |
| dc.subject | 內接合材料 | zh_TW |
| dc.subject | High density | en_US |
| dc.subject | Multilayer substrate | en_US |
| dc.subject | Interconection material | en_US |
| dc.title | 高密度多層構裝基板與接合材料研究---總計畫(III) | zh_TW |
| dc.title | A Study on High Density Multilayer Substrate and Interconnection Materials (III) | en_US |
| dc.type | Plan | en_US |
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