Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
| dc.citation.epage | 0 | en_US |
| dc.citation.issue | 1 | en_US |
| dc.citation.spage | 0 | en_US |
| dc.citation.volume | 6 | en_US |
| dc.citation.woscount | 9 | en_US |
| dc.contributor.author | Lin, Jie-An | en_US |
| dc.contributor.author | Lin, Chung-Kuang | en_US |
| dc.contributor.author | Liu, Chen-Min | en_US |
| dc.contributor.author | Huang, Yi-Sa | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.author | Chu, David T. | en_US |
| dc.contributor.author | Tu, King-Ning | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2019-04-03T06:44:31Z | |
| dc.date.available | 2019-04-03T06:44:31Z | |
| dc.date.issued | 2016-01-01 | en_US |
| dc.description.abstract | Electromigration tests of SnAg solder bump samples with 15 m bump height and Cu under-bump-metallization (UBM) were performed. The test conditions were 1.45 x 10(4) A/cm(2) at 185 degrees C and 1.20 x 10(4) A/cm(2) at 0 degrees C. A porous Cu3Sn intermetallic compound (IMC) structure was observed to form within the bumps after several hundred hours of current stressing. In direct comparison, annealing alone at 185 degrees C will take more than 1000 h for porous Cu3Sn to form, and it will not form at 170 degrees C even after 2000 h. Here we propose a mechanism to explain the formation of this porous structure assisted by electromigration. The results show that the SnAg bump with low bump height will become porous-type Cu3Sn when stressing with high current density and high temperature. Polarity effects on porous Cu3Sn formation is discussed. | en_US |
| dc.identifier.doi | 10.3390/cryst6010012 | en_US |
| dc.identifier.issn | 2073-4352 | en_US |
| dc.identifier.journal | CRYSTALS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.3390/cryst6010012 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/129679 | |
| dc.identifier.wosnumber | WOS:000369511700002 | en_US |
| dc.language.iso | en_US | en_US |
| dc.subject | intermetallic compounds | en_US |
| dc.subject | porous Cu3Sn | en_US |
| dc.subject | electromigration | en_US |
| dc.subject | side wall reaction | en_US |
| dc.title | Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints | en_US |
| dc.type | Article | en_US |