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Plasma-enhanced flexible metal-insulator-metal capacitor using high-k ZrO2 film as gate dielectric with improved reliability

dc.citation.epage1102en_US
dc.citation.spage1098en_US
dc.citation.volume50en_US
dc.citation.woscount5en_US
dc.contributor.authorChu, Min-Chingen_US
dc.contributor.authorMeena, Jagan Singhen_US
dc.contributor.authorCheng, Chih-Chiaen_US
dc.contributor.authorYou, Hsin-Chiangen_US
dc.contributor.authorChang, Feng-Chihen_US
dc.contributor.authorKo, Fu-Hsiangen_US
dc.contributor.department應用化學系zh_TW
dc.contributor.department奈米科技中心zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.contributor.departmentCenter for Nanoscience and Technologyen_US
dc.date.accessioned2019-04-02T05:57:56Z
dc.date.available2019-04-02T05:57:56Z
dc.date.issued2010-08-01en_US
dc.description.abstractWe demonstrate a new flexible metal-insulator-metal capacitor using 9.5-nm-thick ZrO2 film on a plastic polyimide substrate based on a simple and low-cost sal-gel precursor spin-coating process. The surface morphology of the ZrO2 film was investigated using scan electron microscope and atomic force microscope. The as-deposited ZrO2 film under suitable treatment of oxygen (O-2) plasma and then subsequent annealing at 250 degrees C exhibits superior low leakage current density of 9.0 x 10(-9) A/cm(2) at applied voltage of 5 V and maximum capacitance density of 13.3 fF/mu m(2) at 1 MHz. The as-deposited sol-gel film was completely oxidized when we employed O-2 plasma at relatively low temperature and power (30 W), hence enhancing the electrical performance of the capacitor. The shift (Zr 3d from 184.1 eV to 184.64 eV) in X-ray photoelectron spectroscopy of the binding energy of the electrons towards higher binding energy; clearly indicates that the O-2 plasma reaction was most effective process for the complete oxidation of the sol-gel precursor at relatively low processing temperature. (C) 2010 Elsevier Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/j.microrel.2010.05.004en_US
dc.identifier.issn0026-2714en_US
dc.identifier.journalMICROELECTRONICS RELIABILITYen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.microrel.2010.05.004en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/149999
dc.identifier.wosnumberWOS:000280987400009en_US
dc.language.isoen_USen_US
dc.titlePlasma-enhanced flexible metal-insulator-metal capacitor using high-k ZrO2 film as gate dielectric with improved reliabilityen_US
dc.typeArticleen_US

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