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Simulation for optimization of mask error enhancement factor by design of experiments in both dry and immersion ArF lithography

dc.citation.epage6224en_US
dc.citation.issue8Aen_US
dc.citation.spage6216en_US
dc.citation.volume45en_US
dc.citation.woscount0
dc.contributor.authorYeh, Kwei-Tinen_US
dc.contributor.authorLin, Chih-Hungen_US
dc.contributor.authorHu, Ji-Renen_US
dc.contributor.authorLoong, Wen-Anen_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.date.accessioned2014-12-08T15:16:09Z
dc.date.available2014-12-08T15:16:09Z
dc.date.issued2006-08-01en_US
dc.description.abstractSimulations for the optimization of the mask error enhancement factor (MEEF) by using Taguchi's design of experiment (DOE) method in both dry and immersion ArF lithography have been demonstrated here. By DOE, MEEF has been successfully reduced, and the process window hash also been enlarged. Furthermore, in immersion lithography, MEEF has been significantly reduced, and resolution is also enhanced. In this study, we determined the optimal process and optical parameters to enlarge the process window and reduce MEEFs for different types of mask by DOE.en_US
dc.identifier.doi10.1143/JJAP.45.6216en_US
dc.identifier.issn0021-4922en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERSen_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.45.6216en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/11988
dc.identifier.wosnumberWOS:000240512800031
dc.language.isoen_USen_US
dc.subjectmask error enhancement factoren_US
dc.subjectprocess windowen_US
dc.subjectTaguchi design of experimenten_US
dc.subjectimmersion lithographyen_US
dc.titleSimulation for optimization of mask error enhancement factor by design of experiments in both dry and immersion ArF lithographyen_US
dc.typeArticleen_US

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