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A new hybrid method for H2S-sensitive devices using WO3-based film and ACF interconnect

dc.citation.epageen_US
dc.citation.issue7en_US
dc.citation.volume24en_US
dc.citation.woscount1
dc.contributor.authorKuo, Li Minen_US
dc.contributor.authorShih, Yu-Taien_US
dc.contributor.authorWu, Cen-Shawnen_US
dc.contributor.authorLin, Yu-Chien_US
dc.contributor.authorChao, Shuchien_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.department電機學院zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.date.accessioned2014-12-08T15:31:15Z
dc.date.available2014-12-08T15:31:15Z
dc.date.issued2013-07-01en_US
dc.description.abstractA new hybrid integration method has been reported for process simplification of conventional metal-oxide sensors with a gold (Au) dopant-like catalyst during hydrogen sulfide (H2S) gas detections at room temperature. Different from conventional fabrications, an anisotropic conduction film (ACF) followed by a sputtered tungsten oxide (WO3) film tapped on Cu electrodes has been utilized in consumer applications. The process steps were reduced without compromising electrical performances. The treated ACF with a thin WO3 film, coated across two closely spaced microelectrodes is employed as the H2S solid-state sensor at room temperature. Apart from exhibiting good interconnects as conductive bumps, Au dopant-like catalyst within ACF will also produce a lower barrier between the bands of electronics, and therefore improve the electrical conductivity significantly. Our integration method offers a number of merits, including high sensitivity to the reference gas, lead-free bonding connection, low-temperature fabrication, high throughput and less fabrication time.en_US
dc.identifier.doi10.1088/0957-0233/24/7/075105en_US
dc.identifier.issn0957-0233en_US
dc.identifier.journalMEASUREMENT SCIENCE & TECHNOLOGYen_US
dc.identifier.urihttp://dx.doi.org/10.1088/0957-0233/24/7/075105en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/22258
dc.identifier.wosnumberWOS:000320449100038
dc.language.isoen_USen_US
dc.subjectH2Sen_US
dc.subjectgas sensoren_US
dc.subjectACFen_US
dc.subjectWO3en_US
dc.subjectAu-catalysten_US
dc.titleA new hybrid method for H2S-sensitive devices using WO3-based film and ACF interconnecten_US
dc.typeArticleen_US

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