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Nanometer-scale conversion of Si3N4 to SiOx

dc.citation.epage362en_US
dc.citation.issue3en_US
dc.citation.spage360en_US
dc.citation.volume76en_US
dc.citation.woscount70
dc.contributor.authorChien, FSSen_US
dc.contributor.authorChang, JWen_US
dc.contributor.authorLin, SWen_US
dc.contributor.authorChou, YCen_US
dc.contributor.authorChen, TTen_US
dc.contributor.authorGwo, Sen_US
dc.contributor.authorChao, TSen_US
dc.contributor.authorHsieh, WFen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:45:46Z
dc.date.available2014-12-08T15:45:46Z
dc.date.issued2000-01-17en_US
dc.description.abstractIt has been found that atomic force microscope (AFM) induced local oxidation is an effective way for converting thin (< 5 nm) Si3N4 films to SiOx. The threshold voltage for the 4.2 nm film is as low as 5 V and the initial growth rate is on the order of 10(3) nm/s at 10 V. Micro-Auger analysis of the selectively oxidized region revealed the formation of SiOx. Due to the large chemical selectivity in various etchants and great thermal oxidation rate difference between Si3N4, SiO2, and Si, AFM patterning of Si3N4 films can be a promising method for fabricating nanoscale structures. (C) 2000 American Institute of Physics. [S0003-6951(00)03003-5].en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/30799
dc.identifier.wosnumberWOS:000084675100037
dc.language.isoen_USen_US
dc.titleNanometer-scale conversion of Si3N4 to SiOxen_US
dc.typeArticleen_US

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