Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate
| dc.citation.epage | 379 | en_US |
| dc.citation.issue | 6 | en_US |
| dc.citation.spage | 375 | en_US |
| dc.citation.volume | 6 | en_US |
| dc.citation.woscount | 2 | |
| dc.contributor.author | Chiou, BS | en_US |
| dc.contributor.author | Chang, JH | en_US |
| dc.contributor.author | Duh, JG | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:03:03Z | |
| dc.date.available | 2014-12-08T15:03:03Z | |
| dc.date.issued | 1995-12-01 | en_US |
| dc.description.abstract | Thermal cycling effects on Sn/Pb solder and electroless Cu-plated AIN substrates are investigated. X-ray diffraction patterns reveal the existence of Cu2O for the electroless Cu-plated AIN after thermal cycling in an environmental chamber. Moisture in the chamber results in the oxidation of electroless plated Cu and fracture takes place at the Cu2O/Cu interface. The oxidation of Cu is also confirmed by Auger depth profile and electrical sheet resistance measurement. For the solder/Cu/AIN system, fracture occurs at the Cu/solder interface. No intermetallic compounds between solder and Cu are found after thermal cycling. Stress resulting from the thermal expansion mismatch is the major cause of loss of adhesion. | en_US |
| dc.identifier.issn | 0957-4522 | en_US |
| dc.identifier.journal | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/1631 | |
| dc.identifier.wosnumber | WOS:A1995TK73600002 | |
| dc.language.iso | en_US | en_US |
| dc.title | Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate | en_US |
| dc.type | Article | en_US |