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Chemical vapor deposition of tantalum carbide and carbonitride thin films from Me3CE=Ta(CH2CMe3)(3) (E = CH, N)

dc.citation.epage369en_US
dc.citation.issue2en_US
dc.citation.spage365en_US
dc.citation.volume13en_US
dc.citation.woscount12
dc.contributor.authorChang, YHen_US
dc.contributor.authorWu, JBen_US
dc.contributor.authorChang, PJen_US
dc.contributor.authorChiu, HTen_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.date.accessioned2014-12-08T15:41:32Z
dc.date.available2014-12-08T15:41:32Z
dc.date.issued2003en_US
dc.description.abstractChemical vapor deposition (CVD) of thin films employing Me3CCH=Ta(CH2CMe3)(3) and Me3CN=Ta(CH2CMe3)(3) as the precursors has been carried out. TaC and TaCN films were deposited at relatively low temperatures (623-923 K). In comparison, using Me3CN=Ta(CH2CMe3)(3), the Ta=N bond did not undergo cleavage during the reaction and the N atom was incorporated into the film as nitride. The volatile components evolved were collected and examined by GC-MS, FT-IR, H-1 and C-13 NMR spectroscopy. Possible decomposition pathways of the tantalum complexes are proposed to rationalize the observation.en_US
dc.identifier.doi10.1039/b208129fen_US
dc.identifier.issn0959-9428en_US
dc.identifier.journalJOURNAL OF MATERIALS CHEMISTRYen_US
dc.identifier.urihttp://dx.doi.org/10.1039/b208129fen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/28249
dc.identifier.wosnumberWOS:000180805300039
dc.language.isoen_USen_US
dc.titleChemical vapor deposition of tantalum carbide and carbonitride thin films from Me3CE=Ta(CH2CMe3)(3) (E = CH, N)en_US
dc.typeArticleen_US

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