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Improving Safe Operating Area of nLDMOS Array With Embedded Silicon Controlled Rectifier for ESD Protection in a 24-V BCD Process

dc.citation.epage2951en_US
dc.citation.issue9en_US
dc.citation.spage2944en_US
dc.citation.volume58en_US
dc.citation.woscount7
dc.contributor.authorChen, Wen-Yien_US
dc.contributor.authorKer, Ming-Douen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:27:35Z
dc.date.available2014-12-08T15:27:35Z
dc.date.issued2011-09-01en_US
dc.description.abstractIn high-voltage technologies, silicon-controlled rectifier (SCR) is usually embedded in output arrays to provide a robust and self-protected capability against electrostatic discharge (ESD). Although the embedded SCR has been proven as an excellent approach to increasing ESD robustness, mistriggering of the embedded SCR during normal circuit operating conditions can bring other application reliability concerns. In particular, the safe operating area (SOA) of output arrays due to SCR insertion has been seldom evaluated. In this paper, the impact of embedding SCR to the electrical SOA (eSOA) of an n-channel LDMOS (nLDMOS) array has been investigated in a 24-V bipolar CMOS-DMOS process. Experimental results showed that the nLDMOS array suffers substantial degradation on eSOA due to embedded SCR. Design approaches, including a new proposed poly-bending (PB) layout, were proposed and verified in this paper to widen the eSOA of the nLDMOS array with embedded SCR. Both the high ESD robustness and the improved SOA of circuit operation can be achieved by the new proposed PB layout in the nLDMOS array.en_US
dc.identifier.doi10.1109/TED.2011.2159861en_US
dc.identifier.issn0018-9383en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2011.2159861en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/19825
dc.identifier.wosnumberWOS:000294175900019
dc.language.isoen_USen_US
dc.subjectElectrostatic discharge (ESD)en_US
dc.subjectpoly-bending (PB) layouten_US
dc.subjectreliabilityen_US
dc.subjectsafe operating area (SOA)en_US
dc.subjectsilicon-controlled rectifier (SCR)en_US
dc.titleImproving Safe Operating Area of nLDMOS Array With Embedded Silicon Controlled Rectifier for ESD Protection in a 24-V BCD Processen_US
dc.typeArticleen_US

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