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Testing process performance based on the yield: an application to the liquid-crystal display module

dc.citation.epage1241en_US
dc.citation.issue8en_US
dc.citation.spage1235en_US
dc.citation.volume42en_US
dc.citation.woscount2
dc.contributor.authorChen, JPen_US
dc.contributor.authorPearn, WLen_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.date.accessioned2014-12-08T15:42:07Z
dc.date.available2014-12-08T15:42:07Z
dc.date.issued2002-08-01en_US
dc.description.abstractProcess capability indices have been introduced to provide numerical measures on whether a manufacturing process is capable of reproducing items meeting the specifications predetermined by the product designers or the consumers. Process yield is one of the most common criteria used in the manufacturing industry for measuring process performance. The formula S-pk has been proposed to calculate the process yield for normal processes. The formula Spk provides an exact measure on the process yield. Unfortunately, the statistical properties of the estimated (S) over cap (pk) are mathematically intractable. In this paper, we apply the bootstrap simulation method to construct the lower confidence bound of S-pk. We then present a real-world application to the liquid-crystal display module process, to illustrate how we may apply the formula Spk to actual data collected from the factories. (C) 2002 Elsevier Science Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/S0026-2714(02)00081-1en_US
dc.identifier.issn0026-2714en_US
dc.identifier.journalMICROELECTRONICS RELIABILITYen_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0026-2714(02)00081-1en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/28605
dc.identifier.wosnumberWOS:000177626100012
dc.language.isoen_USen_US
dc.titleTesting process performance based on the yield: an application to the liquid-crystal display moduleen_US
dc.typeArticleen_US

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