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智慧型仿生系統之晶片系統平台技術開發---子計畫一:三維電極感測陣列之研發(III)

dc.contributor.author邱俊誠en_US
dc.contributor.authorCHIOU JIN-CHERNen_US
dc.contributor.department國立交通大學電機與控制工程學系(所)zh_TW
dc.date.accessioned2014-12-13T10:45:02Z
dc.date.available2014-12-13T10:45:02Z
dc.date.issued2010en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC99-2220-E009-019zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=2159102&docId=347483en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/100249
dc.language.isozh_TWen_US
dc.subject微機電技術zh_TW
dc.subject微組裝zh_TW
dc.subject電極zh_TW
dc.subject三維zh_TW
dc.subject植入式系統zh_TW
dc.subjectmicroassemblyen_US
dc.subjectmicroprobe arrayen_US
dc.subjectthree dimensional probe arrayen_US
dc.title智慧型仿生系統之晶片系統平台技術開發---子計畫一:三維電極感測陣列之研發(III)zh_TW
dc.titleThe Development of Three-Dimensional Recording Microelectrode Arrays (III)en_US
dc.typePlanen_US

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