Using buried capacitor in LTCC-MLC balun
| dc.citation.epage | 803 | en_US |
| dc.citation.issue | 15 | en_US |
| dc.citation.spage | 801 | en_US |
| dc.citation.volume | 38 | en_US |
| dc.citation.woscount | 9 | |
| dc.contributor.author | Tang, CW | en_US |
| dc.contributor.author | Chang, CY | en_US |
| dc.contributor.department | 電信工程研究所 | zh_TW |
| dc.contributor.department | Institute of Communications Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:42:11Z | |
| dc.date.available | 2014-12-08T15:42:11Z | |
| dc.date.issued | 2002-07-18 | en_US |
| dc.description.abstract | A novel chip-type ceramic balun designed in the 2.4 GHz ISM band frequency is presented. A buried capacitor is included in the balun, so that the length of the coupled transmission lines can be reduced and can be designed very easily. A meander or spiral broadside coupled-line is adopted to realise the proposed LTCC multi-layer balun. The measured performances of phase and amplitude balance for this LTCC-MLC balun show a good match with computer simulation. | en_US |
| dc.identifier.doi | 10.1049/el:20020586 | en_US |
| dc.identifier.issn | 0013-5194 | en_US |
| dc.identifier.journal | ELECTRONICS LETTERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1049/el:20020586 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/28660 | |
| dc.identifier.wosnumber | WOS:000177339100025 | |
| dc.language.iso | en_US | en_US |
| dc.title | Using buried capacitor in LTCC-MLC balun | en_US |
| dc.type | Article | en_US |