氮化鎵晶圓接合及配合雷射移除藍寶石基板
| dc.contributor.author | 吳耀銓 | en_US |
| dc.contributor.author | YEWCHUNG SERMONWU | en_US |
| dc.contributor.department | 國立交通大學材料科學與工程學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:39:49Z | |
| dc.date.available | 2014-12-13T10:39:49Z | |
| dc.date.issued | 2001 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC90-2216-E009-037 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=673281&docId=128270 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/96841 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 晶圓接合 | zh_TW |
| dc.subject | 藍寶石基板 | zh_TW |
| dc.subject | 氮化鎵 | zh_TW |
| dc.subject | 雷射消融 | zh_TW |
| dc.subject | Wafer bonding | en_US |
| dc.subject | Saphhire substrate | en_US |
| dc.subject | Gallium nitride | en_US |
| dc.subject | Laser ablation | en_US |
| dc.title | 氮化鎵晶圓接合及配合雷射移除藍寶石基板 | zh_TW |
| dc.title | GaN Wafer Bonding and Laser Lift-Off the Sapphire Substrate | en_US |
| dc.type | Plan | en_US |
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