積體電路(IC)化學品及材料開發---子計畫V：積體電路封裝用熱固型聚亞醯胺之研製及特性研究(II)

dc.contributor.author	林木獅	en_US
dc.contributor.author	LIN MU-SHIH	en_US
dc.contributor.department	交通大學應用化學研究所	zh_TW
dc.date.accessioned	2014-12-13T10:36:50Z
dc.date.available	2014-12-13T10:36:50Z
dc.date.issued	1999	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC88-CPC-E009-006	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=460589&docId=84347	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/94210
dc.language.iso	zh_TW	en_US
dc.subject	熱固型	zh_TW
dc.subject	聚亞醯胺	zh_TW
dc.subject	積體電路	zh_TW
dc.subject	封裝材料	zh_TW
dc.subject	合成	zh_TW
dc.subject	Thermoset	en_US
dc.subject	Polyimide	en_US
dc.subject	Integrated circuit (IC)	en_US
dc.subject	Encapsulant	en_US
dc.subject	Synthesis	en_US
dc.title	積體電路(IC)化學品及材料開發---子計畫V：積體電路封裝用熱固型聚亞醯胺之研製及特性研究(II)	zh_TW
dc.title	Preparation and Characterization of Thermosetting Polyimides Used in IC Encapsulants (II)	en_US
dc.type	Plan	en_US

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