In situ characterization of CuCMP slurry and defect reduction using IR thermal camera

Abstract

In order to choose appropriate property of Cu chemical-mechanical polishing (CMP) slurry, we used IR thermal camera to distinguish this slurry that belonged to Preston or non-Preston. The adoption of the IR thermal camera is to choose suitable non-Preston Cu CMP slurry in situ and find out optimal changing timing of step endpoint. Additionally supplementing robust CMP machine, appropriate Cu film quality and pre-treatment, we could obtain a total defect number is less than 10(1) order and achieve excellent Cu CMP performance. Such Cu CMP technology resulting in Cu damascene process work and make sure 0.13 mum and beyond 100 nm Cu process to be reliable and practical. (C) 2004 Published by Elsevier B.V.