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Inverse determination of surface temperature in thin-film/substrate systems with interface thermal resistance

dc.citation.epage3515en_US
dc.citation.issue14-16en_US
dc.citation.spage3507en_US
dc.citation.volume47en_US
dc.citation.woscount6
dc.contributor.authorWu, SKen_US
dc.contributor.authorChu, HSen_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.date.accessioned2014-12-08T15:38:50Z
dc.date.available2014-12-08T15:38:50Z
dc.date.issued2004-07-01en_US
dc.description.abstractThis work examines the effect of interface thermal resistance on the estimation of surface temperatures in thin-film/ substrate systems. A radiation-boundary-condition model based on the acoustic mismatch model (AMM) is employed to consider the interface thermal resistance between thin-film and substrate. The inverse beat conduction problem is solved using the space-marching technique. The influences of interface thermal resistance, measurement locations, and measurement errors on this method are studied in detail. Numerical results show that the inverse method accurately estimates surface conditions and temperature distributions in a two-layer system even with an abrupt temperature drop at the interface. Sensor locations and interface thermal resistance only slightly affect the accuracy of the inverse estimation during the transient process when the exact input data (without measurement errors) are applied. However, the inaccuracy might be amplified by the interface thermal resistance and sensor locations if measurement errors exist. (C) 2004 Elsevier Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/j.ijheatmasstransfer.2004.01.022en_US
dc.identifier.issn0017-9310en_US
dc.identifier.journalINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFERen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.ijheatmasstransfer.2004.01.022en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/26592
dc.identifier.wosnumberWOS:000221630600050
dc.language.isoen_USen_US
dc.titleInverse determination of surface temperature in thin-film/substrate systems with interface thermal resistanceen_US
dc.typeArticleen_US

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