Effects of EUV Irradiation on Poly-Si SONOS NVM Devices

dc.citation.epage616en_US
dc.citation.issue5en_US
dc.citation.spage614en_US
dc.citation.volume32en_US
dc.citation.woscount3
dc.contributor.authorTsui, Bing-Yueen_US
dc.contributor.authorYen, Chih-Chanen_US
dc.contributor.authorLi, Po-Hsuehen_US
dc.contributor.authorLai, Jui-Yaoen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:11:40Z
dc.date.available2014-12-08T15:11:40Z
dc.date.issued2011-05-01en_US
dc.description.abstractThe effects of extreme-ultraviolet (EUV)-irradiation-induced damage on the characteristics of a silicon-oxide-nitride-oxide-silicon (SONOS) memory device are investigated. After EUV irradiation, changes in the memory window and program/erase speed indicate the generation of positive charges and new traps. Retention performance degrades after high-dose irradiation, which indicates that the tunneling layer is damaged. Endurance performance degrades severely because the damage in the blocking oxide results in serious electron back injection after cycling operations. These defects cannot be recovered after 600 degrees C annealing. It is recommended that in-process high-dose EUV irradiation on a SONOS stack after a front-end-of-line process should be avoided.en_US
dc.identifier.doi10.1109/LED.2011.2121052en_US
dc.identifier.issn0741-3106en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2011.2121052en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/8948
dc.identifier.wosnumberWOS:000289908500012
dc.language.isoen_USen_US
dc.subjectExtreme ultraviolet lithography (EUVL)en_US
dc.subjectnonvolatile memory (NVM)en_US
dc.subjectradiation damageen_US
dc.subjectsilicon-oxide-nitride-oxide-silicon (SONOS) memoryen_US
dc.titleEffects of EUV Irradiation on Poly-Si SONOS NVM Devicesen_US
dc.typeArticleen_US

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