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Substrate bias dependence of breakdown progression in ultrathin oxide pMOSFETs

dc.citation.epage271en_US
dc.citation.issue4en_US
dc.citation.spage269en_US
dc.citation.volume24en_US
dc.citation.woscount4
dc.contributor.authorTsai, CWen_US
dc.contributor.authorChen, MCen_US
dc.contributor.authorGu, SHen_US
dc.contributor.authorWang, Ten_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:41:09Z
dc.date.available2014-12-08T15:41:09Z
dc.date.issued2003-04-01en_US
dc.description.abstractNegative substrate bias-enhanced oxide breakdown (BD) progression in ultrathin oxide (1.4 nm) pMOS is observed. The enhanced progression is attributed to the increase of hole-stress current resulting from BD-induced, channel-carrier heating. The carrier temperature extracted from the spectral distribution of hot-carrier luminescence is around 1300 K. The substrate bias dependence of post-BD hole-tunneling current is confirmed from measurement and calculation. The observed phenomenon is particularly significant to ultrathin gate oxide reliability in floating substrate (SOI) and forward-biased substrate devices.en_US
dc.identifier.doi10.1109/LED.2003.810890en_US
dc.identifier.issn0741-3106en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2003.810890en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/28006
dc.identifier.wosnumberWOS:000183670900022
dc.language.isoen_USen_US
dc.subjectbreakdown (BD) progressionen_US
dc.subjectcarrier temperatureen_US
dc.subjectsubstrate biasen_US
dc.subjectultrathin oxide pMOSen_US
dc.titleSubstrate bias dependence of breakdown progression in ultrathin oxide pMOSFETsen_US
dc.typeArticleen_US

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