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Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms

dc.citation.epage626en_US
dc.citation.issue5en_US
dc.citation.spage613en_US
dc.citation.volume17en_US
dc.citation.woscount8
dc.contributor.authorHuang, Pei-Yuen_US
dc.contributor.authorLee, Yu-Minen_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.date.accessioned2014-12-08T15:09:35Z
dc.date.available2014-12-08T15:09:35Z
dc.date.issued2009-05-01en_US
dc.description.abstractThe capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns during modern IC design. This paper presents an accurate and fast analytical full-chip thermal simulator for early-stage temperature-aware chip design. By using the generalized integral transforms (GIT), an accurate formulation is derived to estimate the temperature distribution of full-chip with a truncated set of spatial bases which only needs very small truncation points. Then, we develop a fast Fourier transform like evaluating algorithm to efficiently evaluate the derived formulation. Experimental results confirm that the proposed GIT-based analyzer can achieve an order of magnitude speedup compared with a highly efficient Green's function-based thermal simulator. Finally, we propose a 3-D IC thermal simulator and demonstrate its efficiency and accuracy.en_US
dc.identifier.doi10.1109/TVLSI.2008.2006043en_US
dc.identifier.issn1063-8210en_US
dc.identifier.journalIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/TVLSI.2008.2006043en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/7332
dc.identifier.wosnumberWOS:000265457700003
dc.language.isoen_USen_US
dc.subjectCircuit simulationen_US
dc.subjectgeneralized integral transforms (GITs)en_US
dc.subjectphysical designen_US
dc.subjectsimulationen_US
dc.subjectthermal analysisen_US
dc.subject3-D ICen_US
dc.titleFull-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transformsen_US
dc.typeArticleen_US

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