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Nanocrystallization and interfacial tension of sol-gel derived memory

dc.citation.epageen_US
dc.citation.issue12en_US
dc.citation.volume92en_US
dc.citation.woscount5
dc.contributor.authorWu, Chi-Changen_US
dc.contributor.authorTsai, Yi-Jenen_US
dc.contributor.authorChu, Min-Chingen_US
dc.contributor.authorYang, Shao-Mingen_US
dc.contributor.authorKo, Fu-Hsiangen_US
dc.contributor.authorLiu, Pin-Linen_US
dc.contributor.authorYang, Wen-Luhen_US
dc.contributor.authorYou, Hsin-Chiangen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:12:26Z
dc.date.available2014-12-08T15:12:26Z
dc.date.issued2008-03-24en_US
dc.description.abstractThe formation of the nanocrystals (NCs) by using the sol-gel spin-coating method at various annealing temperatures had been studied. The film started to form the islands at 600 degrees C annealing, and finally transferred into NCs at 900 degrees C. A model was proposed to explain the transformation of thin film. The morphology of sol-gel thin film at 600 degrees C annealing was varied and had higher interfacial energy. The crystallized process at 900 degrees C annealing could minimize the energy. The retention for 900 degrees C annealed sample exhibited less than 30% charge loss after 10(6) s at 125 degrees C measurement. (c) 2008 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2904626en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2904626en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/9560
dc.identifier.wosnumberWOS:000254510300082
dc.language.isoen_USen_US
dc.titleNanocrystallization and interfacial tension of sol-gel derived memoryen_US
dc.typeArticleen_US

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