鋁栓塞製程於深次微米元件之應用研究(II)
| dc.contributor.author | 吳文發 | en_US |
| dc.contributor.department | 國立交通大學毫微米實驗室 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:37:06Z | |
| dc.date.available | 2014-12-13T10:37:06Z | |
| dc.date.issued | 1999 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC88-2215-E317-001 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=428974&docId=76776 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94382 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 深次微米 | zh_TW |
| dc.subject | 鋁栓 | zh_TW |
| dc.subject | 多層互連 | zh_TW |
| dc.subject | 平坦化 | zh_TW |
| dc.subject | 擴散障礙層 | zh_TW |
| dc.subject | 電漿處理 | zh_TW |
| dc.subject | 接觸電阻 | zh_TW |
| dc.subject | 鋁濺鍍 | zh_TW |
| dc.subject | Deep submicrometer | en_US |
| dc.subject | Al plug | en_US |
| dc.subject | Multilevel interconnect | en_US |
| dc.subject | Planarization | en_US |
| dc.subject | Diffusion barrier | en_US |
| dc.subject | Plasma treatment | en_US |
| dc.subject | Contact resistance | en_US |
| dc.subject | Al sputtering | en_US |
| dc.title | 鋁栓塞製程於深次微米元件之應用研究(II) | zh_TW |
| dc.title | Applications of Al Plug for Deep Sub-Micron Devices (II) | en_US |
| dc.type | Plan | en_US |
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