MEASUREMENT OF THIN OXIDE-FILMS ON IMPLANTED SI-SUBSTRATE BY ELLIPSOMETRY

Abstract

In this study, the thickness of oxide film which is deposited by low-temperature chemical vapor deposition (LTCVD) on an implanted silicon substrate was measured by multiple-angle incident (MAI) ellipsometry. By using this method, the refractive index, thickness, and the effective index of the substrate can be calculated simultaneously. It is found that the thickness of oxide film on an implanted silicon substrate is only 4% different from that on a nonimplanted silicon substrate under the same deposition conditions. The result shows that a higher implantation energy results in a higher effective substrate index. Even with a high temperature and long annealing process, the refractive index of the implanted silicon substrate cannot recover to the value of nonimplanted silicon substrate.