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The effect of device electrode geometry on performance after hot-carrier stress in amorphous In-Ga-Zn-O thin film transistors with different via-contact structures

dc.citation.volume110en_US
dc.contributor.authorLiao, Po-Yungen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorChen, Yu-Jiaen_US
dc.contributor.authorSu, Wan-Chingen_US
dc.contributor.authorChen, Bo-Weien_US
dc.contributor.authorChen, Li-Huien_US
dc.contributor.authorHsieh, Tien-Yuen_US
dc.contributor.authorYang, Chung-Yien_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorZhang, Sheng-Dongen_US
dc.contributor.authorHuang, Yen-Yuen_US
dc.contributor.authorChang, Hsi-Mingen_US
dc.contributor.authorChiang, Shin-Chuanen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.date.accessioned2018-08-21T05:54:05Z
dc.date.available2018-08-21T05:54:05Z
dc.date.issued2017-05-15en_US
dc.description.abstractIn this letter, the effects of hot carriers on amorphous In-Ga-Zn-O thin film transistors (TFTs) of different geometric structures were investigated. Three types of via-contact structure TFTs are used in this experiment, defined as source-drain large (SD large), source-drain normal (SD normal), and fork-shaped. After hot-carrier stress, the I-V curves of both SD normal and fork-shaped TFTs with U-shaped drains show a threshold voltage shift along with the parasitic transistor characteristic in the reverse-operation mode. Asymmetrical degradation is exhibited in an ISE-TCAD simulation of the electric field, which shows the distribution of hot electrons injected into the etch-stop layer below the redundant drain electrode. Published by AIP Publishing.en_US
dc.identifier.doi10.1063/1.4983713en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4983713en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/145571
dc.identifier.wosnumberWOS:000402319500026en_US
dc.language.isoen_USen_US
dc.titleThe effect of device electrode geometry on performance after hot-carrier stress in amorphous In-Ga-Zn-O thin film transistors with different via-contact structuresen_US
dc.typeArticleen_US

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