低介電常數材料與銅製程整合之研究(II)

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902215E009048.pdf (1.59 MB)

902215E009048.pdf (1.59 MB)

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Authors

Keywords

銅內連結 , 低介電常數 , 介電材料 , 製程整合 , Cu interconnection , Low dielectric constant , Dielectric material , Process integration

URI

https://www.grb.gov.tw/search/planDetail?id=665635&docId=126356
https://ir.lib.nycu.edu.tw/handle/11536/93424

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研究計畫;;Research Plans