低介電常數材料與銅製程整合之研究(II)

Title:	低介電常數材料與銅製程整合之研究(II) Study on the Integration of Low Dielectric Constant Materials and Copper Interconnect (II)
Authors:	施敏 SZE SIMON MIN 國立交通大學電子工程學系
Keywords:	銅內連結;低介電常數;介電材料;製程整合;Cu interconnection;Low dielectric constant;Dielectric material;Process integration
Issue Date:	2001
Gov't Doc #:	NSC90-2215-E009-048
URI:	http://hdl.handle.net/11536/93424 https://www.grb.gov.tw/search/planDetail?id=665635&docId=126356
Appears in Collections:	Research Plans

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APA	施., & SZE S. MIN (2001). 低介電常數材料與銅製程整合之研究(II). https://www.grb.gov.tw/search/planDetail?id=665635&docId=126356.
Bibtex	@article{2001, title={低介電常數材料與銅製程整合之研究(II)}, author={施敏 and SZE SIMON MIN}, journal={https://www.grb.gov.tw/search/planDetail?id=665635&docId=126356}, year={2001}, url={https://ir.lib.nycu.edu.tw/handle/11536/93424}, }