低介電常數材料與銅製程整合之研究(II)

標題:	低介電常數材料與銅製程整合之研究(II) Study on the Integration of Low Dielectric Constant Materials and Copper Interconnect (II)
作者:	施敏 SZE SIMON MIN 國立交通大學電子工程學系
關鍵字:	銅內連結;低介電常數;介電材料;製程整合;Cu interconnection;Low dielectric constant;Dielectric material;Process integration
公開日期:	2001
官方說明文件#:	NSC90-2215-E009-048
URI:	http://hdl.handle.net/11536/93424 https://www.grb.gov.tw/search/planDetail?id=665635&docId=126356
Appears in Collections:	Research Plans

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