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Temperature effects of n-MOSFET devices with uniaxial mechanical strains

dc.citation.epageG278en_US
dc.citation.issue8en_US
dc.citation.spageG276en_US
dc.citation.volume9en_US
dc.citation.woscount4
dc.contributor.authorTsai, MNen_US
dc.contributor.authorChang, TCen_US
dc.contributor.authorLiu, PTen_US
dc.contributor.authorCheng, Oen_US
dc.contributor.authorHuang, CTen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.date.accessioned2014-12-08T15:17:35Z
dc.date.available2014-12-08T15:17:35Z
dc.date.issued2006en_US
dc.description.abstractThis work presents a means of causing mechanical uniaxial stress in n-type metal-oxide-semiconductor field-effect transistors (MOSFETs). The proposed method provided a valuable reference for research into both strained-Si and the temperature effect. In this article, tensile stress is applied parallel or perpendicular to the channel direction at room and high temperature. The shift in the energy levels of strained silicon depends on the direction of uniaxial strain, and changes the average in-plane transport mass. (c) 2006 The Electrochemical Society.en_US
dc.identifier.doi10.1149/1.2205121en_US
dc.identifier.issn1099-0062en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.2205121en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/12758
dc.identifier.wosnumberWOS:000238468300020
dc.language.isoen_USen_US
dc.titleTemperature effects of n-MOSFET devices with uniaxial mechanical strainsen_US
dc.typeArticleen_US

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