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Dichromatic InGaN-based white light emitting diodes by using laser lift-off and wafer-bonding schemes

dc.citation.epageen_US
dc.citation.issue16en_US
dc.citation.volume90en_US
dc.citation.woscount20
dc.contributor.authorLee, Y. J.en_US
dc.contributor.authorLin, P. C.en_US
dc.contributor.authorLu, T. C.en_US
dc.contributor.authorKuo, H. C.en_US
dc.contributor.authorWang, S. C.en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:14:14Z
dc.date.available2014-12-08T15:14:14Z
dc.date.issued2007-04-16en_US
dc.description.abstractAn InGaN-based dual-wavelength blue/green (470 nm/550 nm) light emitting diode (LED) with three terminal operations has been designed and fabricated by using sapphire laser lift-off and wafer-bonding schemes. The device is equivalent to a parallel connection of blue and green LEDs; thus the effective electrical resistance of the device could be reduced. The luminous efficiency is 40 lm/W at 20 mA, accompanied by a broad electroluminescence emission with a combination of blue and green colors. This monolithically integrated dichromatic lighting structure has great potential in the application of the solid-state lighting. (c) 2007 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2722672en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2722672en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/10894
dc.identifier.wosnumberWOS:000245870400015
dc.language.isoen_USen_US
dc.titleDichromatic InGaN-based white light emitting diodes by using laser lift-off and wafer-bonding schemesen_US
dc.typeArticleen_US

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