積體電路化學品與材料之開發---子計畫IV：積體電路封裝用含矽基聚亞醯胺材料之製備及相關性質研究(II)
| dc.contributor.author | 黃華宗 | en_US |
| dc.contributor.author | WHANG WHA-TZONG | en_US |
| dc.contributor.department | 交通大學材料科學與工程研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:36:49Z | |
| dc.date.available | 2014-12-13T10:36:49Z | |
| dc.date.issued | 1999 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC88-CPC-E009-008 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=460592&docId=84348 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/94194 | |
| dc.language.iso | zh_TW | en_US |
| dc.subject | 含矽高分子 | zh_TW |
| dc.subject | 聚亞醯胺 | zh_TW |
| dc.subject | 積體電路 | zh_TW |
| dc.subject | 構裝 | zh_TW |
| dc.subject | 合成 | zh_TW |
| dc.subject | Silicone polymer | en_US |
| dc.subject | Polyimide | en_US |
| dc.subject | Integrated circuit (IC) | en_US |
| dc.subject | Package | en_US |
| dc.subject | Synthesis | en_US |
| dc.title | 積體電路化學品與材料之開發---子計畫IV：積體電路封裝用含矽基聚亞醯胺材料之製備及相關性質研究(II) | zh_TW |
| dc.title | A Study on Synthesis and Characteristics of Silicon-Containing Polyimide for IC Package Application(II) | en_US |
| dc.type | Plan | en_US |