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Soft-mold-induced self-construction of polymer patterns under microwave irradiation

dc.citation.epageen_US
dc.citation.issue19en_US
dc.citation.volume90en_US
dc.citation.woscount4
dc.contributor.authorKo, Fu-Hsiangen_US
dc.contributor.authorWu, Chia-Tienen_US
dc.contributor.authorChen, Mei-Fenen_US
dc.contributor.authorChen, Jem-Kunen_US
dc.contributor.authorChu, Tieh-Chien_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department材料科學與工程學系奈米科技碩博班zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentGraduate Program of Nanotechnology , Department of Materials Science and Engineeringen_US
dc.date.accessioned2014-12-08T15:14:04Z
dc.date.available2014-12-08T15:14:04Z
dc.date.issued2007-05-07en_US
dc.description.abstractIn this study, the authors used a soft-mold-induced self-construction method to fabricate three-dimensional patterns under microwave irradiation for 1 min. The authors estimated the actual pattern growth temperature using a fluorescence probe technique. The temperature at which pattern growth originated was, by necessity, higher than the glass transition temperature of the novolak resist. Electrostatic forces and surface tension effects under the electromagnetic field contributed significantly to the pattern growth, and the use of an antisticking agent allowed easy demolding. (C) 2007 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.2737364en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2737364en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/10809
dc.identifier.wosnumberWOS:000246413400022
dc.language.isoen_USen_US
dc.titleSoft-mold-induced self-construction of polymer patterns under microwave irradiationen_US
dc.typeArticleen_US

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