Novel cleaning solutions for polysilicon film post chemical mechanical polishing
| dc.citation.epage | 340 | en_US |
| dc.citation.issue | 7 | en_US |
| dc.citation.spage | 338 | en_US |
| dc.citation.volume | 21 | en_US |
| dc.citation.woscount | 13 | |
| dc.contributor.author | Pan, TM | en_US |
| dc.contributor.author | Lei, TF | en_US |
| dc.contributor.author | Chen, CC | en_US |
| dc.contributor.author | Chao, TS | en_US |
| dc.contributor.author | Liaw, MC | en_US |
| dc.contributor.author | Yang, WL | en_US |
| dc.contributor.author | Tsai, MS | en_US |
| dc.contributor.author | Lu, CP | en_US |
| dc.contributor.author | Chang, WH | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:45:06Z | |
| dc.date.available | 2014-12-08T15:45:06Z | |
| dc.date.issued | 2000-07-01 | en_US |
| dc.description.abstract | Novel cleaning solutions were developed for post-CMP process, surfactant tetra methyl ammonium hydroxide (TMAH) and/or chelating agent ethylene diamine tetra acetic acid (EDTA) were added into the diluted ammonium hydroxide (NH4OH+H2O) alkaline aqueous solution to enhance removal of metallic and organic contamination, From the experimental result, it is found that the particle and metal removal efficiency and the electrical characteristics are significantly improved for post-CMP cleaning. | en_US |
| dc.identifier.doi | 10.1109/55.847373 | en_US |
| dc.identifier.issn | 0741-3106 | en_US |
| dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1109/55.847373 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/30422 | |
| dc.identifier.wosnumber | WOS:000087898300004 | |
| dc.language.iso | en_US | en_US |
| dc.subject | cleaning | en_US |
| dc.subject | CMP | en_US |
| dc.subject | EDTA | en_US |
| dc.subject | polysilicon | en_US |
| dc.subject | TMAH | en_US |
| dc.title | Novel cleaning solutions for polysilicon film post chemical mechanical polishing | en_US |
| dc.type | Article | en_US |