Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
| dc.citation.volume | 11 | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Juang, Jing-Ye | en_US |
| dc.contributor.author | Lu, Chia-Ling | en_US |
| dc.contributor.author | Li, Yu-Jin | en_US |
| dc.contributor.author | Tu, K. N. | en_US |
| dc.contributor.author | Chen, Chih | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2019-04-02T06:00:50Z | |
| dc.date.available | 2019-04-02T06:00:50Z | |
| dc.date.issued | 2018-12-01 | en_US |
| dc.description.abstract | Highly (111)-oriented Cu pillar-bumps were bonded to highly (111)-oriented Cu films at temperatures ranging from 200 degrees C/100 degrees C to 350 degrees C/100 degrees C in N-2 ambient conditions. The microstructures of the bonded interfaces affected the shear strength performance of the bonded Cu joints. The bonded interfaces at 300 degrees C/100 degrees C and 350 degrees C/100 degrees C had far fewer voids than interfaces bonded at 200 degrees C/100 degrees C and 250 degrees C/100 degrees C. In addition, grain growth took place across the bonding interfaces at temperatures above 300 degrees C/100 degrees C. The corresponding orientation map (OIM) showed the preferred orientation of large grown grains to be <100>. Shear tests revealed that the fracture mode was brittle for joints bonded at 200 degrees C/100 degrees C, but became ductile after bonded above 300 degrees C/100 degrees C. Based on the results, we found that voids and grain growth behavior play import roles in the shear strength performance of bonded Cu joints. | en_US |
| dc.identifier.doi | 10.3390/ma11122368 | en_US |
| dc.identifier.issn | 1996-1944 | en_US |
| dc.identifier.journal | MATERIALS | en_US |
| dc.identifier.uri | http://dx.doi.org/10.3390/ma11122368 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/148750 | |
| dc.identifier.wosnumber | WOS:000456419200026 | en_US |
| dc.language.iso | en_US | en_US |
| dc.subject | Cu-to-Cu direct bonding | en_US |
| dc.subject | nanotwinned Cu | en_US |
| dc.subject | surface diffusion | en_US |
| dc.subject | grain growth | en_US |
| dc.subject | shear strength | en_US |
| dc.title | Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu | en_US |
| dc.type | Article | en_US |