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Modification of polymer substrates with low surface free energy material by low-temperature cured polybenzoxazine

dc.citation.epage56en_US
dc.citation.issue1en_US
dc.citation.spage52en_US
dc.citation.volume29en_US
dc.citation.woscount16
dc.contributor.authorLiao, Chun-Syongen_US
dc.contributor.authorWu, Jiann-Shingen_US
dc.contributor.authorWang, Chih-Fengen_US
dc.contributor.authorChang, Feng-Chihen_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.date.accessioned2014-12-08T15:12:43Z
dc.date.available2014-12-08T15:12:43Z
dc.date.issued2008-01-02en_US
dc.description.abstractThe B-ala/AIBN PBZ system has a high extent of ring-opening of oxazine because phenol-containing oligomers are formed at the early stage of the curing process. As a result, the B-ala/AIBN PBZ system possesses a relatively stronger intramolecular hydrogen bonding and lower surface energy than the pure B-ala system at low temperature curing. In this context, poly(4-vinyl pyridine), poly(4-vinyl phenol) thin films and polycarbonate substrates, which lack liquid resistance, possess low surface free energy after modification with B-ala/AIBN = 5/1 PBZ.en_US
dc.identifier.doi10.1002/marc.200700646en_US
dc.identifier.issn1022-1336en_US
dc.identifier.journalMACROMOLECULAR RAPID COMMUNICATIONSen_US
dc.identifier.urihttp://dx.doi.org/10.1002/marc.200700646en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/9776
dc.identifier.wosnumberWOS:000252529300007
dc.language.isoen_USen_US
dc.titleModification of polymer substrates with low surface free energy material by low-temperature cured polybenzoxazineen_US
dc.typeArticleen_US

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