Fabrication of pattern-depended metal induced lateral crystallization polysilicon thin film transistors with NH3 plasma passivation effects

Abstract

A pattern-dependent metal-induced lateral crystallized (PDMILC) poly-Si thin film transistor was successfully demonstrated and characterized. The fabrication of new PDMILC is simple with only four-mask process. After NH3 plasma passivation, the device performance was enhanced, including the high on/off current ration (>10(6)), the high mobilit (31.19 cm(2)/Vs), and the steep subtreshold swing (0.483 V/dec). The performance of PDMLC TFT with NH3 plasma passivation is superior to that of the counterpart without NH3 plasma passivation. The NH3 plasma treatment can result in the effective hydrogen passivation of the grain-boundary dangling bonds, and the nitrogen piile-up at SiO2/poly-Si interface.