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Implementation of a CMOS/MEMS Accelerometer with ASIC Processes

dc.citation.volume10en_US
dc.citation.woscount0en_US
dc.contributor.authorLiu, Yu-Sianen_US
dc.contributor.authorWen, Kuei-Annen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2019-04-02T05:58:19Z
dc.date.available2019-04-02T05:58:19Z
dc.date.issued2019-01-01en_US
dc.description.abstractThis paper presents the design, simulation and mechanical characterization of a newly proposed complementary metal-oxide semiconductor (CMOS)/micro-electromechanical system (MEMS) accelerometer. The monolithic CMOS/MEMS accelerometer was fabricated using the 0.18 m application-specific integrated circuit (ASIC)-compatible CMOS/MEMS process. An approximate analytical model for the spring design is presented. The experiments showed that the resonant frequency of the proposed tri-axis accelerometer was around 5.35 kHz for out-plane vibration. The tri-axis accelerometer had an area of 1096 m x 1256 m.en_US
dc.identifier.doi10.3390/mi10010050en_US
dc.identifier.issn2072-666Xen_US
dc.identifier.journalMICROMACHINESen_US
dc.identifier.urihttp://dx.doi.org/10.3390/mi10010050en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/148928
dc.identifier.wosnumberWOS:000459735300049en_US
dc.language.isoen_USen_US
dc.subjectaccelerometer designen_US
dc.subjectspring designen_US
dc.subjectanalytical modelen_US
dc.titleImplementation of a CMOS/MEMS Accelerometer with ASIC Processesen_US
dc.typeArticleen_US

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