<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

Compressed-width leaky EH1 mode PBG antenna

dc.citation.epage344en_US
dc.citation.issue8en_US
dc.citation.spage343en_US
dc.citation.volume13en_US
dc.citation.woscount1
dc.contributor.authorWu, CKen_US
dc.contributor.authorChen, YCen_US
dc.contributor.authorTzuang, CKCen_US
dc.contributor.department傳播研究所zh_TW
dc.contributor.departmentInstitute of Communication Studiesen_US
dc.date.accessioned2014-12-08T15:40:36Z
dc.date.available2014-12-08T15:40:36Z
dc.date.issued2003-08-01en_US
dc.description.abstractThe recently developed electric-magnetic-electric (EME) microstrip is successfully used to design a compact leaky-mode antenna with fan beam radiation patterns. The EME microstrip consists of composite metals paralleling the electric and magnetic surfaces, where the magnetic surface is made of an array of coupled inductors. The frequency scanning behavior, experimentally and theoretically confirmed by matrix-pencil analyses, indicates that the line width can be reduced by 20%, compared to that of the conventional microstrip with the identical radiation angle of the first higher order (EH1) mode at the same frequency.en_US
dc.identifier.doi10.1109/LMWC.2003.815692en_US
dc.identifier.issn1531-1309en_US
dc.identifier.journalIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1109/LMWC.2003.815692en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/27694
dc.identifier.wosnumberWOS:000185048800018
dc.language.isoen_USen_US
dc.subjectleaky-mode antennaen_US
dc.subjectmatrix-pencil methoden_US
dc.subjectphotonic bandgap (PBG)en_US
dc.titleCompressed-width leaky EH1 mode PBG antennaen_US
dc.typeArticleen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
000185048800018.pdf
Size:
268.32 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: