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Hydrogen Instability Induced by Postannealing on Poly-Si TFTs

dc.citation.epage1807en_US
dc.citation.issue6en_US
dc.citation.volume59en_US
dc.citation.woscount0
dc.contributor.authorLiao, Chia-Chunen_US
dc.contributor.authorLin, Min-Chenen_US
dc.contributor.authorChao, Tien-Shengen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.date.accessioned2014-12-08T15:23:12Z
dc.date.available2014-12-08T15:23:12Z
dc.date.issued2012-06-01en_US
dc.description.abstractThis brief investigates hydrogen instability induced by postannealing. Results show that using a SiN capping layer can prevent the release of hydrogen from a polycrystalline-silicon channel. However, removing this SiN capping layer allows the hydrogen release during postannealing, and the resulting device performance becomes comparable to that of the control sample. Hydrogen release reduces the immunity of PBTI and NBTI. Two possible mechanisms can explain the increased preexisting defects associated with hydrogen release, which affects the NBTI and PBTI.en_US
dc.identifier.issn0018-9383en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/16284
dc.identifier.wosnumberWOS:000304243600035
dc.language.isoen_USen_US
dc.subjectHydrogen releaseen_US
dc.subjectNBTIen_US
dc.subjectPBTIen_US
dc.subjectplasma dischargeen_US
dc.subjectpostannealingen_US
dc.titleHydrogen Instability Induced by Postannealing on Poly-Si TFTsen_US
dc.typeArticleen_US

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