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Memory effect of oxide/SiC : O/oxide sandwiched structures

dc.citation.epage2096en_US
dc.citation.issue12en_US
dc.citation.spage2094en_US
dc.citation.volume84en_US
dc.citation.woscount6
dc.contributor.authorChang, TCen_US
dc.contributor.authorYan, STen_US
dc.contributor.authorYang, FMen_US
dc.contributor.authorLiu, PTen_US
dc.contributor.authorSze, SMen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:39:27Z
dc.date.available2014-12-08T15:39:27Z
dc.date.issued2004-03-22en_US
dc.description.abstractThe memory effects of the oxide/oxygen-incorporated silicon carbide (SiC:O)/oxide sandwiched structure were investigated. The memory window is decreased with the increase of the oxygen content in the SiC:O film due to the reduction of dangling bonds. A concise model is proposed to explain the reduction of dangling bonds with increasing oxygen content. Also, a higher breakdown voltage is observed with less oxygen content in the SiC:O film, which is attributed to the high barrier height induced by electron trapping in the SiC:O film. (C) 2004 American Institute of Physics.en_US
dc.identifier.doi10.1063/1.1675924en_US
dc.identifier.issn0003-6951en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.1675924en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/26940
dc.identifier.wosnumberWOS:000220268500028
dc.language.isoen_USen_US
dc.titleMemory effect of oxide/SiC : O/oxide sandwiched structuresen_US
dc.typeArticleen_US

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