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Nitrogen effects on the integrity of silicon dioxide grown on polycrystalline silicon

dc.citation.epageH886en_US
dc.citation.issue10en_US
dc.citation.spageH883en_US
dc.citation.volume154en_US
dc.citation.woscount0
dc.contributor.authorLai, Chao Sungen_US
dc.contributor.authorKao, Chyuan Hauren_US
dc.contributor.authorLee, Chung Lenen_US
dc.contributor.authorLei, Tan Fuen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2014-12-08T15:15:11Z
dc.date.available2014-12-08T15:15:11Z
dc.date.issued2007en_US
dc.description.abstractIn this paper, we describe a simple technique to achieve a thin nitrided polyoxide film, only requiring an extra nitrogen implantation to be compatible with the floating gate nonvolatile memory process. The integrity of polyoxides is improved by using the through-silicon-gate nitrogen implantation. Nitridation can be achieved by implanting nitrogen into polysilicon gate followed by a high temperature annealing to drive the nitrogen atoms across the polysilicon, through the polyoxide, and to incorporate nitrogen at the polyoxide/polysilicon interface. The nitrogen-rich layer formed during the driven-in process not only strengthens the polyoxide structure but also improves the polyoxide quality. Improvements of electrical characteristics such as a low leakage current, a low electron trapping, and a high breakdown field for both positive and negative biases have been observed. (c) 2007 The Electrochemical Society.en_US
dc.identifier.doi10.1149/1.2767854en_US
dc.identifier.issn0013-4651en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.2767854en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/11406
dc.identifier.wosnumberWOS:000248984700069
dc.language.isoen_USen_US
dc.titleNitrogen effects on the integrity of silicon dioxide grown on polycrystalline siliconen_US
dc.typeArticleen_US

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