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Formation of m-plane AlN on plasma-nitrided m-plane sapphire

dc.citation.epage0en_US
dc.citation.spage0en_US
dc.citation.volume58en_US
dc.citation.woscount0en_US
dc.contributor.authorMa, Zhih-Chengen_US
dc.contributor.authorChiu, Kun-Anen_US
dc.contributor.authorWei, Lin-Lungen_US
dc.contributor.authorChang, Lien_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.date.accessioned2019-08-02T02:15:24Z
dc.date.available2019-08-02T02:15:24Z
dc.date.issued2019-06-01en_US
dc.description.abstractMicrowave plasma using a gas mixture of N-2 and H-2 has been applied for the nitridation of m-plane sapphire substrate to form a thick epitaxial AlN film. The X-ray diffraction results show that the AlN films formed on the sapphire surface by nitridation for a period from 10-60 min are in (1010) orientation and have an epitaxial relationship with the substrate. The thickness of the nitride film increases with nitridation time and approaches about 0.5 mu m after nitridation for 1 h, while the film surface becomes rough. The film quality is reasonably good, as evaluated with the X-ray rocking curve of (1010) AlN. Faceted voids in the sapphire substrate underneath the AlN are also observed with inclined a-plane facets after nitridation. (C) 2019 The Japan Society of Applied Physicsen_US
dc.identifier.doi10.7567/1347-4065/ab0ad3en_US
dc.identifier.issn0021-4922en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.identifier.urihttp://dx.doi.org/10.7567/1347-4065/ab0ad3en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/152147
dc.identifier.wosnumberWOS:000474911400041en_US
dc.language.isoen_USen_US
dc.titleFormation of m-plane AlN on plasma-nitrided m-plane sapphireen_US
dc.typeArticleen_US

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