Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt% Ag-0.5 wt% Cu Solder
| dc.citation.epage | R143 | en_US |
| dc.citation.spage | R140 | en_US |
| dc.citation.woscount | 0 | en_US |
| dc.contributor.author | Chang, Tai-Min | en_US |
| dc.contributor.author | Chen, Fu-Hsin | en_US |
| dc.contributor.author | Chen, Meng-Yen | en_US |
| dc.contributor.author | Wu, YewChung Sermon | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2015-12-02T02:59:21Z | |
| dc.date.available | 2015-12-02T02:59:21Z | |
| dc.date.issued | 2015-01-01 | en_US |
| dc.description.abstract | High thermal resistance of LED die-attached (DA) material degraded LED\'s performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305. (C) 2015 The Electrochemical Society. All rights reserved. | en_US |
| dc.identifier.doi | 10.1149/2.0071509jss | en_US |
| dc.identifier.issn | 2162-8769 | en_US |
| dc.identifier.journal | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | en_US |
| dc.identifier.uri | http://dx.doi.org/10.1149/2.0071509jss | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/128096 | |
| dc.identifier.wosnumber | WOS:000358991700010 | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt% Ag-0.5 wt% Cu Solder | en_US |
| dc.type | Article | en_US |
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